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INTEGRATED CIRCUITS
DATA SHEET
TDA8712; TDF8712 8-bit digital-to-analog converters
Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 June 1994
Philips Semiconductors
Philips Semiconductors
Product specification
8-bit digital-to-analog converters
FEATURES * 8-bit resolution * Conversion rate up to 50 MHz * TTL input levels * Internal reference voltage generator * Two complementary analog voltage outputs * No deglitching circuit required * Internal input register * Low power dissipation * Internal 75 output load (connected to the analog supply) * Very few external components required * Temperature range - TDA8712: 0 to 70 C - TDF8712: -40 to +85 C. ORDERING INFORMATION PACKAGE TYPE NUMBER PINS TDA8712 TDF8712 TDA8712T TDF8712T 16 16 16 16 PIN POSITION DIP DIP SO16L SO16L APPLICATIONS
TDA8712; TDF8712
* High-speed digital-to-analog conversion * Digital TV including: - field progressive scan - line progressive scan * Subscriber TV decoders * Satellite TV decoders * Digital VCRs * Industrial and automotive. GENERAL DESCRIPTION The TDA8712 and TDF8712 are 8-bit digital-to-analog converters (DACs) for video and other applications. They convert the digital input signal into an analog voltage output at a maximum conversion rate of 50 MHz. No external reference voltage is required and all digital inputs are TTL compatible.
MATERIAL plastic plastic plastic plastic
CODE SOT38-1 SOT38-1 SOT162-1 SOT162-1
June 1994
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
QUICK REFERENCE DATA SYMBOL VCCA PARAMETER analog supply voltage TDA8712 TDF8712 VCCD digital supply voltage TDA8712 TDF8712 ICCA ICCD VOUT(p-p) analog supply current digital supply current full-scale analog output voltage differences between VOUT and VOUT (peak-to-peak value) DC integral linear error DC differential linearity error maximum conversion rate -3 dB analog bandwidth total power dissipation TDA8712 TDF8712 Notes 1. D0 to D7 are connected to VCCD and CLK is connected to DGND. 160 170 note 1 note 1 ZL = 10 k; note 2 ZL = 75 ; note 2 4.5 4.75 20 16 -1.45 -0.72 - - 50 fclk = 50 MHz; note 3 - 4.5 4.75 CONDITIONS MIN.
TDA8712; TDF8712
TYP. 5.0 5.0 5.0 5.0 26 23 -1.60 0.80 0.3 0.3 - 150 250 250
MAX. 5.5 5.25 5.5 5.25 32 30 -1.75 -0.88 0.5 0.5 - - 340 325 V V V V
UNIT
mA mA V V LSB LSB MHz MHz mW mW
ILE DLE fclk(max) B Ptot
2. The analog output voltages (VOUT and VOUT) are negative with respect to VCCA (see Table 1). The output resistance between VCCA and each of these outputs is typically 75 . 3. The -3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input code transition (code 0 to 255).
June 1994
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
BLOCK DIAGRAM
TDA8712; TDF8712
handbook, full pagewidth
REF 100 nF
1 BAND-GAP REFERENCE CURRENT REFERENCE LOOP
DGND AGND
6 2 CURRENT GENERATORS 75 5 CLOCK INPUT INTERFACE CURRENT SWITCHES
16 75 15 14
VCCA
CLK
VOUT VOUT
TDA8712 TDF8712
(LSB) D0 D1 D2 D3 D4 D5 D6 (MSB) D7 12 11 3 4 10 9 8 7
REGISTERS
VCCD
DATA INPUT INTERFACE
MBC915 - 1
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
PINNING SYMBOL REF AGND D2 D3 CLK DGND D7 D6 D5 D4 D1 D0 VCCD VOUT VOUT VCCA PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION voltage reference (decoupling) analog ground data input; bit 2 data input; bit 3 clock input digital ground data input; bit 7 (MSB) data input; bit 6 data input; bit 5 data input; bit 4 data input; bit 1 data input; bit 0 (LSB) digital supply voltage (+5 V) analog output voltage complimentary analog output voltage analog supply voltage (+5 V)
DGND D7 D6 6 7 8
handbook, halfpage
TDA8712; TDF8712
REF AGND D2 D3 CLK
1 2 3 4 5 TDA8712 TDF8712
16 V CCA 15 VOUT 14 V OUT 13 V CCD 12 D0
11 D1 10 9
MBC901 - 1
D4 D5
Fig.2 Pin configuration.
June 1994
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL VCCA VCCD VCC VGND VI Itot Tstg Tamb PARAMETER analog supply voltage digital supply voltage supply voltage differences between VCCA and VCCD input voltage (pins 3 to 5 and 7 to 12) total output current (IOUT + IOUT; pins 14 and 15) storage temperature operating ambient temperature TDA8712 TDF8712 Tj HANDLING junction temperature 0 -40 -
TDA8712; TDF8712
MIN. -0.3 -0.3 -0.5 -0.3 -5 -55
MAX. +7.0 +7.0 +0.5 +0.1 VCCD +26 +150 +70 +85 +150 V V V V V mA C C C C
UNIT
ground voltage differences between VAGND and VDGND -0.1
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT38-1 SOT162-1 PARAMETER thermal resistance from junction to ambient in free air 70 90 K/W K/W VALUE UNIT
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
CHARACTERISTICS VCCA = V16 to V2 = 4.5 to 5.5 V (TDA8712) = 4.75 to 5.25 V (TDF8712); VCCD = V13 to V6 = 4.5 to 5.5 V (TDA8712) = 4.75 to 5.25 V (TDF8712); VCCA to VCCD = -0.5 to +0.5 V (TDA8712) = -0.25 to +0.25 V (TDF8712); REF decoupled to AGND via a 100 nF capacitor; Tamb = -40 to +85 C; AGND and DGND shorted together; typical readings taken at VCCA = VCCD = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supply VCCA analog supply voltage TDA8712 TDF8712 VCCD digital supply voltage TDA8712 TDF8712 ICCA ICCD VGND Inputs DIGITAL INPUTS (D7 TO D0) AND CLOCK INPUT CLK VIL VIH IIL IIH fclk(max) VOUT(p-p) LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current maximum clock frequency VI = 0.4 V VI = 2.7 V 0 2.0 - - 50 -1.45 -0.72 - - - fclk = 50 MHz; note 3 - - - - - - - - -0.3 0.01 - -1.60 0.80 -3 - - 150 0.6 1 75 0.3 0.3 0.8 VCCD -0.4 20 - -1.75 -0.88 -25 200 20 - - - - 0.5 0.5 V V mA A MHz analog supply current digital supply current ground voltage differences between VAGND and VDGND note 1 note 1 4.5 4.75 20 16 -0.1 5.0 5.0 26 23 - 5.5 5.25 32 30 +0.1 V V mA mA V 4.5 4.75 5.0 5.0 5.5 5.25 V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Outputs (referenced to VCCA) full-scale analog output voltage ZL = 10 k; note 2 differences between VOUT and ZL = 75 ; note 2 VOUT (peak-to-peak value) analog offset output voltage full-scale analog output voltage temperature coefficient analog offset output voltage temperature coefficient -3 dB analog bandwidth differential gain differential phase output impedance code = 0 V V mV V/K V/K MHz % deg
Vos TCVOUT TCVos B Gdiff diff Zo
Transfer function (fclk = 50 MHz) ILE DLE DC integral linear error DC differential linearity error LSB LSB
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Switching characteristics (fclk = 50 MHz; notes 4 and 5; see Figs 3, 4 and 5) tSU;DAT tHD;DAT tPD tS1 tS2 td data set-up time data hold time propagation delay time settling time 1 settling time 2 input to 50% output delay time 10% to 90% full-scale change to 1 LSB 10% to 90% full-scale change to 1 LSB -0.3 2.0 - - - - - - - - 1.1 6.5 3.0 - - - 1.0 1.5 8.0 5.0 ns ns ns ns ns ns
Output transients (glitches; fclk = 50 MHz; note 6; see Fig.6) Eg Notes 1. D0 to D7 are connected to VCCD and CLK is connected to DGND. 2. The analog output voltages (VOUT and VOUT) are negative with respect to VCCA (see Table 1). The output resistance between VCCA and each of these outputs is typically 75 . 3. The -3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input code transition (code 0 to 255). 4. The worst case characteristics are obtained at the transition from input code 0 to 255 and if an external load impedance greater than 75 is connected between VOUT or VOUT and VCCA. The specified values have been measured with an active probe between VOUT and AGND. No further load impedance between VOUT and AGND has been applied. All input data is latched at the rising edge of the clock. The output voltage remains stable (independent of input data variations) during the HIGH level of the clock (CLK = HIGH). During a LOW-to-HIGH transition of the clock (CLK = LOW), the DAC operates in the transparent mode (input data will be directly transferred to their corresponding analog output voltages; see Fig.5. 5. The data set-up time (tSU;DAT) is the minimum period preceding the rising edge of the clock that the input data must be stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the rising edge of the clock and still be recognized. The data hold time (tHD;DAT) is the minimum period following the rising edge of the clock that the input data must be stable in order to be correctly registered. A negative hold time indicates that the data may be released prior to the rising edge of the clock and still be recognized. 6. The definition of glitch energy and the measurement set-up are shown in Fig.6. The glitch energy is measured at the input transition between code 127 and 128 and on the falling edge of the clock. glitch energy from code transition 127 to 128 30 LSBns
June 1994
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
Table 1 Input coding and output voltages (typical values; referenced to VCCA, regardless of the offset voltage). DAC OUTPUT VOLTAGES (V) CODE INPUT DATA (D7 to D0) ZL = 10 k VOUT 0 1 . 128 . 254 255 000 00 00 000 000 01 . 100 000 00 . 111 111 10 111 111 11 0 -0.006 . -0.8 . -1.594 -1.6 VOUT -1.6 -1.594 . -0.8 . -0.006 0 ZL = 75 VOUT 0 -0.003 . -0.4 . -0.797 -0.8 VOUT -0.8 -0.797 . -0.4 . -0.003 0
andbook, full pagewidth
t SU; DAT
t HD; DAT 3.0 V
input data
stable
1.3 V 0V
3.0 V CLK
MBC912
1.3 V 0V
The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within 0.3 ns after the first rising edge of the clock (tSU;DAT is negative; -0.3 ns). Data must be held at least 2 ns after the rising edge (tHD;DAT = +2 ns).
Fig.3 Data set-up and hold times.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
andbook, full pagewidth
CLK
1.3 V
code 255 input data (example of a full-scale input transition) code 0 1.3 V 1 LSB VCCA (code 0) 10 %
td
50 %
VOUT
90 % VCCA 1.6 V (code 255) t S1 t PD t S2 1 LSB
MBC913
Fig.4 Switching characteristics.
handbook, full pagewidth
CLK
transparent mode
latched mode
1.3 V
input codes
V OUT analog output voltage
MBC914 - 1
transparent mode
latched mode (stable output)
beginning of transparent mode
During the transparent mode (CLK = LOW), any change of input data will be seen at the output. During the latched mode (CLK = HIGH), the analog output remains stable regardless of any change at the input. A change of input data during the latched mode will be seen on the falling edge of the clock (beginning of the transparent mode).
Fig.5 Latched and transparent mode.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
handbook, full pagewidth
HP8082A PULSE GENERATOR (SLAVE) PULSE GENERATOR (SLAVE)
1/10 f clk
TEK P6201 D7 MSB D6 D5 D4 D3 D2 D1 D0 (LSB) f clk 3 clock VOUT VOUT DYNAMIC PROBE R = 100 k C = 3 pF
TEK7104 and TEK7A26 OSCILLOSCOPE bandwidth = 20 MHz
HP8082A
1/10 f clk
TDA8712 TDF8712
DIVIDER ( 10)
f clk
PULSE GENERATOR (MASTER) MODEL EH107
1
1 LSB code 127 code 128 VOUT
2 timing diagram
MBC916
time
The value of the glitch energy is the sum of the shaded area measured in LSBns.
Fig.6 Glitch energy measurement.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
INTERNAL PIN CONFIGURATIONS
TDA8712; TDF8712
handbook, full pagewidth
V CCA
V REF regulation loop
output current generators
REF
AGND
MBC911 - 1
Fig.7 Reference voltage generator decoupling.
handbook, halfpage
V CCA
handbook, halfpage
DGND
D0 to D7, CLK
AGND substrate
MBC908
AGND
MBC910
Fig.8 AGND and DGND.
Fig.9 D7 to D0 and CLK.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
handbook, halfpage
VCCA 75 VOUT
handbook, halfpage
75
VCCD
VOUT
DGND
MBC907
AGND bit n bit n
MBC909 - 1
switches and current generators
Fig.10 Digital supply.
Fig.11 Analog outputs.
handbook, halfpage
VCCA
AGND
MBC906
Fig.12 Analog supply.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
APPLICATION INFORMATION
TDA8712; TDF8712
Additional application information can be supplied on request (please quote "FTV/8901").
handbook, halfpage nF (1) 100
REF AGND
VCCA VOUT VOUT VO
TDA8712 TDF8712
MBC905 - 1
(1) This is a recommended value for decoupling pin 1. VO = -VOUT; see Table 1; ZL = 10 k.
Fig.13 Analog output voltage without external load.
(1) handbook, halfpage 100 nF
REF AGND
VCCA ZL VOUT VO Z L / ( Z L 75 )
TDA8712 TDF8712
MBC904 - 1
(1) This is a recommended value for decoupling pin 1. External load ZL = 75 to .
Fig.14 Analog output voltage with external load.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
handbook, halfpage (1) 100 nF
REF 100 F AGND VOUT
VCCA
75 TDA8712 TDF8712
VO 2
MBC903 - 1
AGND
(1) This is a recommended value for decoupling pin 1.
Fig.15 Analog output voltage with AGND as reference.
handbook, full pagewidth
TDA8712 TDF8712
10 H VOUT (pin 15) or VOUT (pin 14) 100 F
12 H
390
27 pF
12 pF 390
39 pF
100 pF
56 pF
Vo [390/(780+75)]
MSA656
Fig.16 Example of anti-aliasing filter (analog output referenced to AGND).
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
Characteristics of Fig. 17 * Order 5; adapted CHEBYSHEV
handbook, halfpage
0
MSA657
* Ripple 0.1 dB * f = 6.7 MHz at -3 dB * fnotch = 9.7 MHz and 13.3 MHz.
(dB) 20
40
60
80
100 0 10 20 30 f i (MHz) 40
Fig.17 Frequency response for filter shown in Fig.16.
handbook, full pagewidth
100 nF
(1)
REF 100 F AGND VOUT VOUT 100 F TDA8712 TDF8712 R2 R1 R1
R2
2 X VO (R2/R1)
AGND
MBC902
(1) This is a recommended value for decoupling pin 1.
Fig.18 Differential mode (improved supply voltage ripple rejection).
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
PACKAGE OUTLINES
TDA8712; TDF8712
seating plane
handbook, full pagewidth
22.00 21.35 3.7 4.7 max max
8.25 7.80
3.9 3.4
0.51 min 2.2 max
2.54 (7x) 1.4 max
0.53 max
0.254 M
0.32 max 7.62 9.5 8.3
MSA254
16
9 6.48 6.14
1
8
Dimensions in mm.
Fig.19 Plastic dual in-line package; 16 leads (300 mil) SOT38-1.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
TDA8712; TDF8712
handbook, full pagewidth
10.5 10.1
7.6 7.4 A
S 0.9 (4x) 0.4
0.1 S
10.65 10.00
16
9 2.45 2.25 1.1 1.0 0.3 0.1 0.32 0.23 1.1 0.5 detail A
2.65 2.35
pin 1 index 1 8 0 to 8
o
MBC233 - 1
1.27
0.49 0.36
0.25 M (16x)
Dimensions in mm.
Fig.20 Plastic small outline package; 16 leads; large body (SOT162-1).
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small-outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C.
TDA8712; TDF8712
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8712; TDF8712
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
NOTES
TDA8712; TDF8712
June 1994
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
NOTES
TDA8712; TDF8712
June 1994
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Philips Semiconductors
Product specification
8-bit digital-to-analog converters
NOTES
TDA8712; TDF8712
June 1994
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Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2327, Fax. (011)829-1849 Canada: INTEGRATED CIRCUITS: Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 601 Milner Ave, SCARBOROUGH, ONTARIO, M1B 1M8, Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H., P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., Components Div., 6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)428 6729 India: Philips INDIA Ltd, Components Dept, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS COMPONENTS S.r.l., Viale F. Testi, 327, 20162 MILANO, Tel. (02)6752.3302, Fax. (02)6752 3300. Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: Philips Components, 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)14163160/4163333, Fax. (01)14163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., Components Division, 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors Limited, P.O. Box 65, Philips House, Torrington Place, LONDON, WC1E 7HD, Tel. (071)436 41 44, Fax. (071)323 03 42 United States: INTEGRATED CIRCUITS: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd., P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404, Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BAF-1, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD31 (c) Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/03/pp24 Document order number: Date of release: June 1994 9397 734 70011
Philips Semiconductors

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